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    • Design and
    Engineering Services

    From first schematic to production-ready enclosure one team, built to manufacture from day one. Our engineering design services cover hardware, pcb design services, firmware, product industrial design, and mechanical design services.

    Get a quote
    prototyping

    Design and Engineering Services

    Get a quote
    1,000+ Design Delivered • Multi-layer ,HDI & RF Capable • Backed by Elecbits XOR
    • 1,000+ Designs Delivered • Multi-layer, HDI & RF Capable • India + Global Markets • Backed by Elecbits XOR • 1,000+ Designs Delivered • Multi-layer, HDI & RF Capable • India + Global Markets • Backed by Elecbits XOR

    At Elecbits, every discipline runs in a connected workflow
    product design and engineering services never made in isolation
    from manufacturing reality.

    At Elecbits, every discipline runs in a connected workflow product design and engineering services never made in isolation from manufacturing reality.

    5000+

    Modular Design
    Repository

    100+

    Product Launched

    5 Mn

    Units Shipped

    Upto 70%

    Reduction in time
    to market

    5000+

    Modular Design Repository

    100+

    Products Launched

    5 Mn

    Units Shipped

    Upto 70%

    Reduction in time to market

    engineering
    engineering

    Four Engineering Disciplines.
    One Integrated Team.

    Hardware Designing
    Firmware Development
    Industrial and Mechanical
    Embedded Testing
    WHAT'S INCLUDED
    Schematic Design and Component Selection −
    Logical circuit design with reliable, cost-effective components BOM optimised for supply chain availability and lifecycle stability through XOR's 7M component database
    PCB Layout +
    Multi-layer, HDI (high-density interconnect), rigid-flex, and high-speed board layouts
    High-Speed and RF/Analog Design +
    Signal integrity (SI), power integrity (PI), impedance control, mixed-signal, and RF layout Wi-Fi, BT/BLE, Zigbee, LoRa, 4G/5G
    Simulation and Analysis +
    Pre/post-layout SI and PI simulation, thermal simulation, FMEA, and MTBF reliability analysis
    DFM/DFA Built In +
    Every design optimised for automated assembly, improved yield, and lower production cost reviewed against in-house fabrication and assembly constraints
    EDA Tooling +
    Altium, OrCAD, Cadence, Mentor professional-grade toolchain, output in Gerber, ODB++, and manufacturer-ready formats
    Design-to-Manufacturing Continuity +
    Schematic → layout → fabrication → assembly under one roof fewer re-spin cycles, lower NRE, faster time to production
    WHAT'S INCLUDED
    Full Stack Development +
    Bootloader, bare-metal, device drivers, middleware, and application logic low to high level
    RTOS and OS Platforms +
    FreeRTOS, Zephyr, embedded Linux (Yocto), Android OS porting and BSP development included
    MCU/SoC Breadth +
    STM32, ESP32, Nordic, NXP, Renesas, Realtek, Intel platforms hardware-matched firmware from day one
    Resource-Constrained Optimisation +
    Power-optimised and memory-efficient code for battery-powered and edge devices
    Connectivity and Protocol Stacks +
    CAN, Modbus, MQTT, BLE, Wi-Fi, cellular cloud and IoT integration across all major protocols
    OTA/FOTA Updatability +
    Secure remote firmware updates field-deployable over-the-air update architecture for connected products
    Security +
    Secure boot, encrypted firmware, and anti-tamper mechanisms built in from the architecture stage
    Edge AI and Embedded ML +
    On-device model integration and inference TinyML, OpenVINO for AI-capable embedded systems
    WHAT'S INCLUDED
    Enclosure Design +
    Handheld, box-type, DIN-rail, rackmount, wall-mount, rugged, and IP-rated enclosures designed to specification
    Industrial Design +
    Aesthetics, ergonomics, and brand-aligned form factor CMF definition through production-ready concept
    3D Modelling and PCB Fit Validation +
    Mechanical CAD validated against PCB 3D models guaranteed fit-within-enclosure before tooling is cut
    Thermal Engineering +
    Thermal simulation, cooling strategy, and heat dissipation design integrated with PCB layout
    Durability and Compliance Design +
    Ruggedness, ingress protection (IP rating), drop and vibration considerations built into every enclosure design
    In-House Prototyping +
    3D printing, CNC machining, and finishing fast iteration from CAD to physical part without external vendors
    DFM for Enclosures +
    Tooling, moulding, and manufacturability reviewed in-house no surprises when the first tool is cut
    WHAT'S INCLUDED
    Board Bring-Up and Validation +
    First-article testing and functional verification of new boards systematic bring-up from power-on to full peripheral validation
    Design Verification and Pre-Certification +
    EMI/EMC, CE, FCC, RoHS, and AEC-Q100 (automotive) pre-compliance de-risk formal certification before lab submission
    Environmental and Reliability Testing +
    Thermal cycling, vibration, mechanical stress, and burn-in scoped to your operating environment and certification target
    Test Automation +
    Automated test case generation, AI-based defect prediction, and automated test rigs consistent coverage across every firmware build
    Custom Test Fixtures and Jigs +
    Production-line test fixtures for QA at assembly built to your product's test requirements for end-of-line validation
    Functional and Production Testing +
    End-of-line testing, yield analysis, and manufacturing diagnostics quality built into production, not inspected in at the end
    HIL and System-Level Validation +
    Hardware-in-the-loop and system-level validation for safety-critical and automotive applications

    Four Engineering Disciplines.
    One Integrated Team.

    Hardware Designing
    Firmware Development
    Industrial and Mechanical
    Embedded Testing
    WHAT'S INCLUDED
    Schematic Design and Component Selection −
    Logical circuit design with reliable, cost-effective components BOM optimised for supply chain availability and lifecycle stability through XOR's 7M component database
    PCB Layout +
    Multi-layer, HDI (high-density interconnect), rigid-flex, and high-speed board layouts
    High-Speed and RF/Analog Design +
    Signal integrity (SI), power integrity (PI), impedance control, mixed-signal, and RF layout Wi-Fi, BT/BLE, Zigbee, LoRa, 4G/5G
    Simulation and Analysis +
    Pre/post-layout SI and PI simulation, thermal simulation, FMEA, and MTBF reliability analysis
    DFM/DFA Built In +
    Every design optimised for automated assembly, improved yield, and lower production cost reviewed against in-house fabrication and assembly constraints
    EDA Tooling +
    Altium, OrCAD, Cadence, Mentor professional-grade toolchain, output in Gerber, ODB++, and manufacturer-ready formats
    Design-to-Manufacturing Continuity +
    Schematic → layout → fabrication → assembly under one roof fewer re-spin cycles, lower NRE, faster time to production
    WHAT'S INCLUDED
    Full Stack Development +
    Bootloader, bare-metal, device drivers, middleware, and application logic low to high level
    RTOS and OS Platforms +
    FreeRTOS, Zephyr, embedded Linux (Yocto), Android OS porting and BSP development included
    MCU/SoC Breadth +
    STM32, ESP32, Nordic, NXP, Renesas, Realtek, Intel platforms hardware-matched firmware from day one
    Resource-Constrained Optimisation +
    Power-optimised and memory-efficient code for battery-powered and edge devices
    Connectivity and Protocol Stacks +
    CAN, Modbus, MQTT, BLE, Wi-Fi, cellular cloud and IoT integration across all major protocols
    OTA/FOTA Updatability +
    Secure remote firmware updates field-deployable over-the-air update architecture for connected products
    Security +
    Secure boot, encrypted firmware, and anti-tamper mechanisms built in from the architecture stage
    Edge AI and Embedded ML +
    On-device model integration and inference TinyML, OpenVINO for AI-capable embedded systems
    WHAT'S INCLUDED
    Enclosure Design +
    Handheld, box-type, DIN-rail, rackmount, wall-mount, rugged, and IP-rated enclosures designed to specification
    Industrial Design +
    Aesthetics, ergonomics, and brand-aligned form factor CMF definition through production-ready concept
    3D Modelling and PCB Fit Validation +
    Mechanical CAD validated against PCB 3D models guaranteed fit-within-enclosure before tooling is cut
    Thermal Engineering +
    Thermal simulation, cooling strategy, and heat dissipation design integrated with PCB layout
    Durability and Compliance Design +
    Ruggedness, ingress protection (IP rating), drop and vibration considerations built into every enclosure design
    In-House Prototyping +
    3D printing, CNC machining, and finishing fast iteration from CAD to physical part without external vendors
    DFM for Enclosures +
    Tooling, moulding, and manufacturability reviewed in-house no surprises when the first tool is cut
    WHAT'S INCLUDED
    Board Bring-Up and Validation +
    First-article testing and functional verification of new boards systematic bring-up from power-on to full peripheral validation
    Design Verification and Pre-Certification +
    EMI/EMC, CE, FCC, RoHS, and AEC-Q100 (automotive) pre-compliance de-risk formal certification before lab submission
    Environmental and Reliability Testing +
    Thermal cycling, vibration, mechanical stress, and burn-in scoped to your operating environment and certification target
    Test Automation +
    Automated test case generation, AI-based defect prediction, and automated test rigs consistent coverage across every firmware build
    Custom Test Fixtures and Jigs +
    Production-line test fixtures for QA at assembly built to your product's test requirements for end-of-line validation
    Functional and Production Testing +
    End-of-line testing, yield analysis, and manufacturing diagnostics quality built into production, not inspected in at the end
    HIL and System-Level Validation +
    Hardware-in-the-loop and system-level validation for safety-critical and automotive applications
    Why Us?

    The Preferred
    Partner for
    Hardware
    Teams

    Designed for Manufacture from Day One

    Every schematic, layout, and enclosure reviewed against real constraints this is what separates engineering design services from engineering advice.

    All Disciplines Under One Roof

    Hardware design services, embedded firmware development, product industrial design, and mechanical engineering services one workflow, no handoffs.

    One Team, Every Certification

    BIS, CE, WPC, FCC, UL, and RoHS certification managed under one accountable team.

    Backed by XOR Intelligence

    Electronic component sourcing and BOM risk informed by XOR's live market data parts that are available, affordable, and lifecycle-safe.

    Manufacturing Runs in Parallel

    As a product engineering company with in-house fabrication, design decisions have direct manufacturing feedback at every stage.

    Why Us?

    The Preferred Partner for Hardware Teams

    Designed for Manufacture from Day One

    Every schematic, layout, and enclosure reviewed against real constraints this is what separates engineering design services from engineering advice.

    All Disciplines Under
    One Roof

    Hardware design services, embedded firmware development, product industrial design, and mechanical engineering services one workflow, no handoffs.

    Backed by XOR Intelligence

    Electronic component sourcing and BOM risk informed by XOR's live market data parts that are available, affordable, and lifecycle-safe.

    Manufacturing Runs
    in Parallel

    As a product engineering company with in-house fabrication, design decisions have direct manufacturing feedback at every stage.

    Build resilient products faster

    Most hardware companies spend 12–18 months concept to production.
    Elecbits compresses that to 3–4 months, without compromising quality.

    Industry Average

    Traditional approach, fragmented vendors

    12–18 months total

    POC
    Proof of Concept
    1–6 units
    60–90 days
    EVT
    Eng. Validation
    Batch up to 50
    60–90 days
    DVT
    Design Validation
    Batch up to 200
    90-120 days
    PVT
    Prod. Validation
    Batch up to 500
    60–90 days
    MP
    Mass Production
    Batch up to 1000+
    90-120 days
    Elecbits Timelines
    End-to-end, under one roof
    3–4 months total
    POC
    Proof of Concept
    1–6 units
    15–20 days
    EVT
    Eng. Validation
    Batch up to 50
    15–20 days
    DVT
    Design Validation
    Batch up to 200
    20–25 days
    PVT
    Prod. Validation
    Batch up to 500
    15–20 days
    MP
    Mass Production
    Batch up to 1000+
    Up to 1 Month

    Build resilient
    products faster

    Most hardware companies spend 12–18 months concept to production. Elecbits compresses that to 3–4 months, without compromising quality.

    Industry Average

    Traditional approach, fragmented vendors

    12–18 months total

    Average production timelines:

    POC
    Proof of Concept
    1–6 units
    60–90 days
    EVT
    Eng. Validation
    Batch up to 50
    60–90 days
    DVT
    Design Validation
    Batch up to 200
    90–120 days
    PVT
    Prod. Validation
    Batch up to 500
    60–90 days
    MP
    Mass Production
    Batch up to 1000+
    90–120 days
    Elecbits Timelines

    End-to-end, under one roof

    3–4 months total

    Elecbits production timelines:

    POC
    Proof of Concept
    1–6 units
    15–20 days
    EVT
    Eng. Validation
    Batch up to 50
    15–20 days
    DVT
    Design Validation
    Batch up to 200
    20–25 days
    PVT
    Prod. Validation
    Batch up to 500
    15–20 days
    MP
    Mass Production
    Batch up to 1000+
    Up to 1 Month

    Industries We Serve In

    Connecting Global Manufacturers for Seamless Innovation

    EV & Automotive

    Industrial

    Consumer

    IT Hardware

    Defense

    EV & Automotive

    Industrial

    Consumer

    IT Hardware

    Defense

    Industries we serve in

    Connecting Global Manufacturers1
    for Seamless Innovation

    EV & Automotive

    EV & Automotive

    Industrial

    Industrial

    Consumer

    Consumer

    IT Hardware

    IT Hardware

    Defense

    Defense

    Our Partners

    Connecting Global Manufacturers for Seamless Innovation

    Logo 5
    Logo 1
    Logo 2
    Logo 4
    Logo 3
    Logo 6 1

    Our Clients

    Connecting Global Manufacturers for Seamless Innovation

    Ready to Build Hardware That Ships?

    Need engineering design services to take your product from
    concept to production book a discovery call?

    Get a quote

    Ready to Build
    Hardware That Ships?

    Need engineering design services to take your product from concept to production book a discovery call?

    Get a quote

    Frequently Asked Questions

    1 Do all five disciplines run under one team?
    Yes pcb design services, embedded hardware design, product industrial design, mechanical design services, and embedded testing delivered by one connected team.
    2Can I engage just one discipline?
    Yes. Our pcb design services, embedded firmware development, and hardware design services are all available as standalone engagements.
    3 How does design connect to manufacturing?
    The team delivering your engineering design services works alongside fabrication and assembly DFM feedback is live, not retrospective.
    4What firmware environments do you support?
    Bare-metal, RTOS, and embedded Linux. Our firmware development services cover BSP bring-up and wireless product design integration across Wi-Fi, BLE, LoRa, and cellular.
    5What CAD tools and file formats do you deliver?
    Altium, KiCad, Cadence for PCB. SolidWorks for mechanical engineering services. We deliver Gerbers, ODB++, STEP, 2D drawings, and BOM.
    6 Do you support power electronics and RF design?
    Yes. Our power electronics design services cover SMPS and BMS. RF design services and RF engineering services cover antenna design, matching networks, and OTA validation.
    TECH